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FatTwin 系列
新一代X11 SupermicroFatTwin™是一款高密度8/4热插入节点SuperServer®系统,具有多种内存容量,HDD技术,M.2 SSD NVMe,PCIe替代方案和网络功能。 FatTwin™支持高达:1.5TB ECC RDIMM DDR2-2666MHz内存,12个DIMM插槽,1个PCI-E 3.0 x16和1个SIOM灵活的新卡8个Broadcom SAS 3.0(12Gbps)端口HBA或HW RAID,10个SATA端口具有Intel®C621控制器的3.0(6Gbps),备用的Titanium Level (96%)数字电源,整合IPMI 2.0,KVM专用LAN,以及双核Intel®Xeon®可扩展处理器系列,最多26核心和165W TDP。 SupermicroFatTwin™代表了绿色计算革命,设计高效;该系统支持客户的关键应用,同时减少数据中心总体拥有成本,从而有助于保护环境,并扩展Supermicro现有的TwinSuperServer®系统的计算和存储功能,从而提高性能和功耗。 由于其共享组件,FatTwin™提高了成本效益和可靠性,而其模块化架构使其灵活配置和易于维护。 多功能配置允许FatTwin™针对许多不同的环境进行优化,包括企业,数据中心,云计算,HPC,财务,科学和工程,文件和存储服务器。 新!支持新一代X11解决方案,双核Intel® Xeon®可扩展处理器,每个节点高达165W 12个DIMM插槽;高达1.5TB ECC RDIMM Low-Profile PCI-E 3.0 x16插槽 SAS3/SATA3/NVMe 支持 2200W / 1200W钛(96%)冗余电源
F619P2-RC1
4U空间支持8个节点,让计算密度最大化
8 Hot-plug System Nodes in 4U
Each node supports:

1. Dual socket P (LGA 3647) supports
    Intel® Xeon® Scalable Processors,
    Dual UPI up to 10.4GT/s
2. Up to 1.5TB ECC 3DS LRDIMM, up to
    DDR4-2666MHz; 12 DIMM slots
3. Expansion slots: 1 PCI-E 3.0 x16 (LP)
    1 PCI-E 3.0 x16 (for SIOM)
4. 6 Hot-swap 2.5" SAS3/SATA3 or 2
    Hot-swap 2.5" SAS3/SATA3 +
    4 optional NVMe U.2
5. SAS3 via Broadcom 3108, HW RAID
6. SIOM Network card,
    1 dedicated IPMI LAN port
7. 1 VGA, 2 USB 3.0 ports
8. 3x 4cm 20k RPM middle fans
9. 2200W Redundant Power Supplies
    Titanium Level (96% Efficiency)
F629P3-RTB
4 Hot-plug System Nodes in 4U
Each node supports:

1. Dual socket P (LGA 3647) supports
    Intel® Xeon® Scalable Processors,
    Dual UPI up to 10.4GT/s
2. Up to 1.5TB ECC 3DS LRDIMM, up to
    DDR4-2666MHz; 12 DIMM slots
3. Expansion slots: 1 PCI-E 3.0 x16 (LP)
    1 PCI-E 3.0 x16 (for SIOM)
4. SIOM Network card,
    1 dedicated IPMI LAN port
5. 1 VGA, 2 USB 3.0 ports
6. 8 Hot-swap 3.5" SATA3 drive bays
7. 2x 8cm 14k RPM middle fans
8. 1200W Redundant Power Supplies
    Titanium Level (96% Efficiency)
支持新一代X11解决方案,双核Intel® Xeon®可扩展处理器,每个节点高达165W
12个DIMM插槽;高达1.5TB ECC RDIMM
Low-Profile PCI-E 3.0 x16插槽
SAS3/SATA3/NVMe 支持
2200W / 1200W钛(96%)冗余电源

F619P2-RT
4U空间支持8个节点,让计算密度最大化
8 Hot-plug System Nodes in 4U
Each node supports:

1. Dual socket P (LGA 3647) supports
    Intel® Xeon® Scalable Processors,
    Dual UPI up to 10.4GT/s
2. Up to 1.5TB ECC 3DS LRDIMM, up to
    DDR4-2666MHz; 12 DIMM slots
3. Expansion slots: 1 PCI-E 3.0 x16 (LP)
    1 PCI-E 3.0 x16 (for SIOM)
4. 6 Hot-swap 2.5" SATA3 drive bays
5. SIOM Network card,
    1 dedicated IPMI LAN port
6. 1 VGA, 2 USB 3.0 ports
7. 3x 4cm 20k RPM middle fans
8. 2200W Redundant Power Supplies
    Titanium Level (96% Efficiency)
F629P3-RC1B
4 Hot-plug System Nodes in 4U
Each node supports:

1. Dual socket P (LGA 3647) supports
    Intel® Xeon® Scalable Processors,
    Dual UPI up to 10.4GT/s
2. Up to 1.5TB ECC 3DS LRDIMM, up to
    DDR4-2666MHz; 12 DIMM slots
3. Expansion slots: 1 PCI-E 3.0 x16 (LP)
    1 PCI-E 3.0 x16 (for SIOM)
4. SIOM Network card,
    1 dedicated IPMI LAN port
5. 1 VGA, 2 USB 3.0 ports
6. 8 Hot-swap 3.5" SAS3/SATA3 or
    6 Hot-swap 3.5" SAS3/SATA3 +
    2 optional NVMe U.2
7. SAS3 via Broadcom 3108, HW RAID
8. 2x 8cm 14k RPM middle fans
9. 1200W Redundant Power Supplies
    Titanium Level (96% Efficiency)
支持新一代X11解决方案,双核Intel® Xeon®可扩展处理器,每个节点高达165W
12个DIMM插槽;高达1.5TB ECC RDIMM
Low-Profile PCI-E 3.0 x16插槽
SAS3/SATA3/NVMe 支持
2200W / 1200W钛(96%)冗余电源